Features of the Calculator

• Calculates the trace width required for a given current in a stripline PCB layout.
• Uses IPC-2221 or IPC-2152 standards for accurate trace width estimation.
• Inputs: Current (A), Thickness (oz/µm), Dielectric Height (mil/mm), Temperature Rise (°C).
• Outputs: Required trace width (mil/mm).
• Responsive and user-friendly design that matches your navy blue website theme.

The formula used in the calculator is:

$$W=\frac{I}{(T\times 0.0254\times \sqrt{\mathrm{\Delta }T})}\times H$$

Where:

• W = Required trace width (mil)
• I = Current (A)
• T= Copper thickness (oz)
• H = Dielectric height (mil)
• ΔT = Temperature rise (°C)

Breakdown of the Formula

1. Current Carrying Capacity

   • The width of a PCB trace depends on the amount of current it needs to carry safely without excessive heating.

   • Higher current requires a wider trace to prevent overheating.

2. Copper Thickness Conversion

   • PCB copper thickness is typically given in ounces per square foot (oz/ft²).

   • To convert oz to micrometers (µm):

     $$1\text{ oz}=35\text{µm}$$

   • To convert oz to mils (thousandths of an inch):

     $$1\text{ oz}=1.37\text{mil}$$

   • The factor $0.0254$ converts from mil to mm.

Temperature Rise Impact

• As current passes through the trace, resistive heating occurs, causing a temperature rise.

• The higher the temperature rise ($\Delta T$), the more the trace width must be adjusted to dissipate heat.

• The square root of the temperature rise is used as an approximation based on empirical PCB heating models.

Dielectric Height Effect

• In a stripline configuration, the dielectric (insulating layer) affects how heat is dissipated and how much width is required.

• A higher dielectric height $H$ generally means more width is needed for a given current.